Proceedings Of The Symposium On Low Temperature Electronic Device Operation

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Device and Circuit Cryogenic Operation for Low Temperature Electronics

Francis Balestra,Gérard Ghibaudo
Device and Circuit Cryogenic Operation for Low Temperature Electronics Book PDF

Author : Francis Balestra,Gérard Ghibaudo
Publisher : Springer Science & Business Media
Page : 280 pages
File Size : 42,5 Mb
Release : 2001-05-31
Category : Technology & Engineering
ISBN : 0792373774

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Device and Circuit Cryogenic Operation for Low Temperature Electronics by Francis Balestra,Gérard Ghibaudo Pdf

Device and Circuit Cryogenic Operation for Low Temperature Electronics is a first in reviewing the performance and physical mechanisms of advanced devices and circuits at cryogenic temperatures that can be used for many applications. The first two chapters cover bulk silicon and SOI MOSFETs. The electronic transport in the inversion layer, the influence of impurity freeze-out, the special electrical properties of SOI structures, the device reliability and the interest of a low temperature operation for the ultimate integration of silicon down to nanometer dimensions are described. The next two chapters deal with Silicon-Germanium and III-V Heterojunction Bipolar Transistors, as well as III-V High Electron Mobility Transistors (HEMT). The basic physics of the SiGe HBT and its unique cryogenic capabilities, the optimization of such bipolar devices, and the performance of SiGe HBT BiCMOS technology at liquid nitrogen temperature are examined. The physical effects in III-V semiconductors at low temperature, the HEMT and HBT static, high frequency and noise properties, and the comparison of various cooled III-V devices are also addressed. The next chapter treats quantum effect devices made of silicon materials. The major quantum effects at low temperature, quantum wires, quantum dots as well as single electron devices and applications are investigated. The last chapter overviews the performances of cryogenic circuits and their applications. The low temperature properties and performance of inverters, multipliers, adders, operational amplifiers, memories, microprocessors, imaging devices, circuits and systems, sensors and read-out circuits are analyzed. Device and Circuit Cryogenic Operation for Low Temperature Electronics is useful for researchers, engineers, Ph.D. and M.S. students working in the field of advanced electron devices and circuits, new semiconductor materials, and low temperature electronics and physics.

Man-Machine-Environment System Engineering: Proceedings of the 21st International Conference on MMESE

Shengzhao Long,Balbir S. Dhillon
Man Machine Environment System Engineering Proceedings of the 21st International Conference on MMESE Book PDF

Author : Shengzhao Long,Balbir S. Dhillon
Publisher : Springer Nature
Page : 899 pages
File Size : 49,7 Mb
Release : 2021-09-21
Category : Technology & Engineering
ISBN : 9789811659638

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Man-Machine-Environment System Engineering: Proceedings of the 21st International Conference on MMESE by Shengzhao Long,Balbir S. Dhillon Pdf

Man-Machine-Environment System Engineering: Proceedings of the 21st Conference on MMESE is the academic showcase of best research papers selected from more than 500 submissions each year. From this book reader will learn the best research topics and the latest development trend in MMESE design theory and other human-centered system application.MMESE focus mainly on the relationship between Man, Machine and Environment. It studies the optimum combination of man-machine-environment systems. In the system, the Man means the working people as the subject in the workplace (e.g. operator, decision-maker); the Machine means the general name of any object controlled by the Man (including tool, Machinery, Computer, system and technology), the Environment means the specially working conditions under which Man and Machine occupy together(e.g. temperature, noise, vibration, hazardous gases etc.). The three goals of the optimization of the system are safety, efficiency and economy.In 1981 with direct support from one of the greatest modern Chinese scientists, Qian Xuesen, Man-Machine-Environment System Engineering (MMESE), the integrated and advanced science research topic was established in China by Professor Shengzhao Long. In the letter to Shengzhao Long, in October 22nd, 1993, Qian Xuesen wrote: “You have created a very important modern science subject and technology in China!”.

Extreme Environment Electronics

John D. Cressler,H. Alan Mantooth
Extreme Environment Electronics Book PDF

Author : John D. Cressler,H. Alan Mantooth
Publisher : CRC Press
Page : 1044 pages
File Size : 46,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351832809

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Extreme Environment Electronics by John D. Cressler,H. Alan Mantooth Pdf

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Thermal and Power Management of Integrated Circuits

Arman Vassighi,Manoj Sachdev
Thermal and Power Management of Integrated Circuits Book PDF

Author : Arman Vassighi,Manoj Sachdev
Publisher : Springer Science & Business Media
Page : 188 pages
File Size : 54,8 Mb
Release : 2006-06-01
Category : Technology & Engineering
ISBN : 9780387297491

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Thermal and Power Management of Integrated Circuits by Arman Vassighi,Manoj Sachdev Pdf

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Proceedings of the 42nd International Conference on Advanced Ceramics and Composites, Volume 39, Issue 3

Jingyang Wang,Waltraud M. Kriven,Tobias Fey,Paolo Colombo,William J. Weber,Jake Amoroso,William G. Fahrenholtz,Kiyoshi Shimamura,Michael Halbig,Soshu Kirihara,Yiquan Wu,Kathleen Shurgart
Proceedings of the 42nd International Conference on Advanced Ceramics and Composites Volume 39 Issue 3 Book PDF

Author : Jingyang Wang,Waltraud M. Kriven,Tobias Fey,Paolo Colombo,William J. Weber,Jake Amoroso,William G. Fahrenholtz,Kiyoshi Shimamura,Michael Halbig,Soshu Kirihara,Yiquan Wu,Kathleen Shurgart
Publisher : John Wiley & Sons
Page : 272 pages
File Size : 53,9 Mb
Release : 2019-01-14
Category : Technology & Engineering
ISBN : 9781119543305

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Proceedings of the 42nd International Conference on Advanced Ceramics and Composites, Volume 39, Issue 3 by Jingyang Wang,Waltraud M. Kriven,Tobias Fey,Paolo Colombo,William J. Weber,Jake Amoroso,William G. Fahrenholtz,Kiyoshi Shimamura,Michael Halbig,Soshu Kirihara,Yiquan Wu,Kathleen Shurgart Pdf

Proceeding of the 42nd International Conference on Advanced Ceramics and Composites, Ceramic Engineering and Science Proceedings Volume 39, Issue 3, 2018 Jingyang Wang, Waltraud Kriven, Tobias Fey, Paolo Colombo, William J. Weber, Jake Amoroso, William G. Fahrenholtz, Kiyoshi Shimamura, Michael Halbig, Soshu Kirihara, Yiquan Wu, and Kathleen Shurgart, Editors Valerie Wiesner and Manabu Fukushima, Volume Editors This proceedings contains a collection of 22 papers from The American Ceramic Society’s 42nd International Conference on Advanced Ceramics and Composites, held in Daytona Beach, Florida, January 21-26, 2018. This issue includes papers presented in the following symposia: • Advancing Frontiers of Ceramics for Sustainable Societal Development – International Symposium in Honor of Dr. Mrityunjay Singh • Symposium 9: Porous Ceramics: Novel Developments and Applications • Symposium 10: Virtual Materials (Computational) Design and Ceramic Genome • Symposium 12 Materials for Extreme Environments: Ultrahigh Temperature Ceramics (UHTCs) and Nano-laminated Ternary Carbides and Nitrides (MAX Phases) • Symposium 13 Advanced Ceramics and Composites for Nuclear Fission and Fusion Energy • Symposium 14 Crystalline Materials for Electrical, Optical and Medical Applications • Symposium 15 Additive Manufacturing and 3D Printing Technologies • Symposium 16: Geopolymers, Inorganic Polymers and Sustainable Materials • Focused Session 1: Bio-inspired Processing of Advanced Materials • 7th Global Young Investigator Forum

3D Flash Memories

Rino Micheloni
3D Flash Memories Book PDF

Author : Rino Micheloni
Publisher : Springer
Page : 380 pages
File Size : 47,8 Mb
Release : 2016-05-26
Category : Computers
ISBN : 9789401775120

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3D Flash Memories by Rino Micheloni Pdf

This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.