Electromigration Modeling At Circuit Layout Level

Author : Cher Ming Tan,Feifei He
Publisher : Springer Science & Business Media
Page : 103 pages
File Size : 51,8 Mb
Release : 2013-03-16
Category : Technology & Engineering
ISBN : 9789814451215

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Electromigration Modeling at Circuit Layout Level by Cher Ming Tan,Feifei He Pdf

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

Author : Cher Ming Tan,Feifei He
Publisher : Springer
Page : 103 pages
File Size : 55,7 Mb
Release : 2013-03-27
Category : Technology & Engineering
ISBN : 9814451223

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Electromigration Modeling at Circuit Layout Level by Cher Ming Tan,Feifei He Pdf

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

Author : Chong Leong, Gan,Chen-Yu, Huang
Publisher : Springer Nature
Page : 223 pages
File Size : 50,5 Mb
Release : 2023-05-30
Category : Computers
ISBN : 9783031267086

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Interconnect Reliability in Advanced Memory Device Packaging by Chong Leong, Gan,Chen-Yu, Huang Pdf

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Author : Cher Ming Tan
Publisher : World Scientific
Page : 312 pages
File Size : 47,7 Mb
Release : 2010
Category : Technology & Engineering
ISBN : 9789814273329

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Electromigration in ULSI Interconnections by Cher Ming Tan Pdf

Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.

Author : Cher Ming Tan,Feifei He
Publisher : Springer
Page : 0 pages
File Size : 53,7 Mb
Release : 2013-05-04
Category : Technology & Engineering
ISBN : 9814451207

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Electromigration Modeling at Circuit Layout Level by Cher Ming Tan,Feifei He Pdf

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

Author : United States. Patent and Trademark Office
Publisher : Unknown
Page : 1226 pages
File Size : 41,7 Mb
Release : 2001
Category : Patents
ISBN : PSU:000066183006

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Official Gazette of the United States Patent and Trademark Office by United States. Patent and Trademark Office Pdf

Author : Jens Lienig,Matthias Thiele
Publisher : Springer
Page : 159 pages
File Size : 53,6 Mb
Release : 2018-02-23
Category : Technology & Engineering
ISBN : 9783319735580

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Fundamentals of Electromigration-Aware Integrated Circuit Design by Jens Lienig,Matthias Thiele Pdf

The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.

Author : Sheldon Tan,Mehdi Tahoori,Taeyoung Kim,Shengcheng Wang,Zeyu Sun,Saman Kiamehr
Publisher : Springer Nature
Page : 460 pages
File Size : 50,9 Mb
Release : 2019-09-12
Category : Technology & Engineering
ISBN : 9783030261726

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Long-Term Reliability of Nanometer VLSI Systems by Sheldon Tan,Mehdi Tahoori,Taeyoung Kim,Shengcheng Wang,Zeyu Sun,Saman Kiamehr Pdf

This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.

Author : L. B. Freund,S. Suresh
Publisher : Cambridge University Press
Page : 772 pages
File Size : 41,7 Mb
Release : 2004-01-08
Category : Technology & Engineering
ISBN : 1139449826

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Thin Film Materials by L. B. Freund,S. Suresh Pdf

Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.

Author : Rohit Sharma
Publisher : CRC Press
Page : 328 pages
File Size : 40,5 Mb
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 9781351831598

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Design of 3D Integrated Circuits and Systems by Rohit Sharma Pdf

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Author : Jörg Henkel,Nikil Dutt
Publisher : Springer Nature
Page : 606 pages
File Size : 51,5 Mb
Release : 2020-12-09
Category : Technology & Engineering
ISBN : 9783030520175

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Dependable Embedded Systems by Jörg Henkel,Nikil Dutt Pdf

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.

Author : Vassilis Paliouras,Johan Vounckx,Diederik Verkest
Publisher : Springer
Page : 756 pages
File Size : 40,7 Mb
Release : 2005-08-25
Category : Computers
ISBN : 9783540320807

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Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation by Vassilis Paliouras,Johan Vounckx,Diederik Verkest Pdf

Welcome to the proceedings of PATMOS 2005, the 15th in a series of international workshops.PATMOS2005wasorganizedbyIMECwithtechnicalco-sponsorshipfrom the IEEE Circuits and Systems Society. Over the years, PATMOS has evolved into an important European event, where - searchers from both industry and academia discuss and investigate the emerging ch- lenges in future and contemporary applications, design methodologies, and tools - quired for the developmentof upcominggenerationsof integrated circuits and systems. The technical program of PATMOS 2005 contained state-of-the-art technical contri- tions, three invited talks, a special session on hearing-aid design, and an embedded - torial. The technical program focused on timing, performance and power consumption, as well as architectural aspects with particular emphasis on modeling, design, char- terization, analysis and optimization in the nanometer era. The Technical Program Committee, with the assistance of additional expert revi- ers, selected the 74 papers to be presented at PATMOS. The papers were divided into 11 technical sessions and 3 poster sessions. As is always the case with the PATMOS workshops, the review process was anonymous, full papers were required, and several reviews were carried out per paper. Beyond the presentations of the papers, the PATMOS technical program was - riched by a series of speeches offered by world class experts, on important emerging research issues of industrial relevance. Prof. Jan Rabaey, Berkeley, USA, gave a talk on “Traveling the Wild Frontier of Ulta Low-Power Design”, Dr. Sung Bae Park, S- sung, gave a presentation on “DVL (Deep Low Voltage): Circuits and Devices”, Prof.

Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 45,7 Mb
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 9781461410522

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Power Electronic Packaging by Yong Liu Pdf

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Author : Luciano Lavagno,Louis Scheffer,Grant Martin
Publisher : CRC Press
Page : 762 pages
File Size : 43,5 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781351837583

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EDA for IC Implementation, Circuit Design, and Process Technology by Luciano Lavagno,Louis Scheffer,Grant Martin Pdf

Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.

Author : Saraju P. Mohanty,Nagarajan Ranganathan,Elias Kougianos,Priyardarsan Patra
Publisher : Springer Science & Business Media
Page : 325 pages
File Size : 51,7 Mb
Release : 2008-05-31
Category : Technology & Engineering
ISBN : 9780387764740

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Low-Power High-Level Synthesis for Nanoscale CMOS Circuits by Saraju P. Mohanty,Nagarajan Ranganathan,Elias Kougianos,Priyardarsan Patra Pdf

This self-contained book addresses the need for analysis, characterization, estimation, and optimization of the various forms of power dissipation in the presence of process variations of nano-CMOS technologies. The authors show very large-scale integration (VLSI) researchers and engineers how to minimize the different types of power consumption of digital circuits. The material deals primarily with high-level (architectural or behavioral) energy dissipation.