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Author : G. S. Mathad,Hamir Singh Rathore,Y. Arita
Publisher : The Electrochemical Society
Page : 358 pages
File Size : 46,9 Mb
Release : 2000
Category : Science
ISBN : 1566772540
Author : Yoshio Nishi,Robert Doering
Publisher : CRC Press
Page : 1720 pages
File Size : 53,8 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420017663
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : Robert Havemann
Publisher : Mrs Conference Proceedings
Page : 640 pages
File Size : 49,5 Mb
Release : 1997
Category : Computers
ISBN : UOM:39015040062161
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Publisher : John Wiley & Sons
Page : 616 pages
File Size : 52,5 Mb
Release : 2012-04-02
Category : Technology & Engineering
ISBN : 9780470662540
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : Harzara S. Rathore
Publisher : The Electrochemical Society
Page : 292 pages
File Size : 51,8 Mb
Release : 1998
Category : Computers
ISBN : 1566771846
Author : Electrochemical Society. Dielectric Science and Technology Division,Electrochemical Society. Electrodeposition Division,Electrochemical Society. Meeting
Publisher : Unknown
Page : 290 pages
File Size : 44,7 Mb
Release : 1999
Category : Science
ISBN : UOM:39015057617741
Author : Krishna Shenai
Publisher : Artech House Publishers
Page : 548 pages
File Size : 42,7 Mb
Release : 1991
Category : Technology & Engineering
ISBN : UOM:39015022352564
This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.
Author : Yosi Shacham-Diamand,Tetsuya Osaka,Madhav Datta,Takayuki Ohba
Publisher : Springer Science & Business Media
Page : 552 pages
File Size : 54,5 Mb
Release : 2009-09-19
Category : Science
ISBN : 9780387958682
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author : T. O. Herndon
Publisher : Unknown
Page : 520 pages
File Size : 41,6 Mb
Release : 1993
Category : Dielectrics
ISBN : UCAL:$B247019
Author : S. P. Murarka
Publisher : Butterworth-Heinemann
Page : 268 pages
File Size : 43,7 Mb
Release : 1993
Category : Computers
ISBN : UOM:39015029202077
This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Author : Robin Cheung,Jeffrey Klein,Kazuo Tsubouchi,Masanori Murakami,Nobuyoshi Kobayashi
Publisher : Materials Research Society
Page : 765 pages
File Size : 53,5 Mb
Release : 2000-02-01
Category : Technology & Engineering
ISBN : 1558994122
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Philip Garrou,Christopher Bower,Peter Ramm
Publisher : John Wiley & Sons
Page : 798 pages
File Size : 44,5 Mb
Release : 2011-09-22
Category : Technology & Engineering
ISBN : 9783527623068
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Author : Daniel C. Edelstein
Publisher : Unknown
Page : 606 pages
File Size : 51,6 Mb
Release : 1999-10-07
Category : Technology & Engineering
ISBN : UOM:39015042090459
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Russell C. Ellwanger,Shi-Qing Wang
Publisher : Materials Research Society
Page : 767 pages
File Size : 49,9 Mb
Release : 2000-02-01
Category : Technology & Engineering
ISBN : 155899341X
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Paul S. Ho,Chao-Kun Hu,Martin Gall,Valeriy Sukharev
Publisher : Cambridge University Press
Page : 128 pages
File Size : 45,5 Mb
Release : 2022-05-12
Category : Technology & Engineering
ISBN : 9781009287791
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.