Download Full eBooks in PDF
2005 Ieee International Integrated Reliability Workshop Final Report Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of 2005 Ieee International Integrated Reliability Workshop Final Report book. This book definitely worth reading, it is an incredibly well-written.
Author : Anonim
Publisher : IEEE
Page : 161 pages
File Size : 53,8 Mb
Release : 2008
Category : Computers
ISBN : 1424440017
Author : Anonim
Publisher : Unknown
Page : 182 pages
File Size : 48,5 Mb
Release : 2005
Category : Integrated circuits
ISBN : 1509097732
Author : Anonim
Publisher : Unknown
Page : 202 pages
File Size : 45,9 Mb
Release : 2005
Category : Integrated circuits
ISBN : UOM:39015058744502
Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Publisher : John Wiley & Sons
Page : 616 pages
File Size : 43,9 Mb
Release : 2012-04-02
Category : Technology & Engineering
ISBN : 9780470662540
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : IEEE Staff,Institute of Electrical and Electronics Engineers (New York, NY)
Publisher : Unknown
Page : 164 pages
File Size : 55,5 Mb
Release : 2011-10-16
Category : Integrated circuits
ISBN : 1457701138
Author : Samuel Vasconcelos Araújo
Publisher : kassel university press GmbH
Page : 238 pages
File Size : 55,9 Mb
Release : 2013-06-13
Category : Semiconductors
ISBN : 9783862194865
Author : IEEE Electron Devices Society
Publisher : IEEE
Page : 106 pages
File Size : 45,9 Mb
Release : 2001
Category : Technology & Engineering
ISBN : 0780371674
Author : Eitan N. Shauly
Publisher : CRC Press
Page : 831 pages
File Size : 42,7 Mb
Release : 2022-11-30
Category : Technology & Engineering
ISBN : 9781000631357
Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Author : Emmanuel Defaÿ
Publisher : John Wiley & Sons
Page : 347 pages
File Size : 55,6 Mb
Release : 2013-02-07
Category : Technology & Engineering
ISBN : 9781118602805
This book describes up-to-date technology applied to high-K materials for More Than Moore applications, i.e. microsystems applied to microelectronics core technologies. After detailing the basic thermodynamic theory applied to high-K dielectrics thin films including extrinsic effects, this book emphasizes the specificity of thin films. Deposition and patterning technologies are then presented. A whole chapter is dedicated to the major role played in the field by X-Ray Diffraction characterization, and other characterization techniques are also described such as Radio frequency characterization. An in-depth study of the influence of leakage currents is performed together with reliability discussion. Three applicative chapters cover integrated capacitors, variables capacitors and ferroelectric memories. The final chapter deals with a reasonably new research field, multiferroic thin films.
Author : Michael G. Pecht,Myeongsu Kang
Publisher : John Wiley & Sons
Page : 800 pages
File Size : 51,8 Mb
Release : 2018-08-15
Category : Technology & Engineering
ISBN : 9781119515302
An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.
Author : Anonim
Publisher : IEEE
Page : 168 pages
File Size : 44,8 Mb
Release : 2007-01-01
Category : Technology & Engineering
ISBN : 1424411718
Author : Jens Lienig,Matthias Thiele
Publisher : Springer
Page : 159 pages
File Size : 55,9 Mb
Release : 2018-02-23
Category : Technology & Engineering
ISBN : 9783319735580
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Author : Alvin W. Strong,Ernest Y. Wu,Rolf-Peter Vollertsen,Jordi Sune,Giuseppe La Rosa,Timothy D. Sullivan,Stewart E. Rauch, III
Publisher : John Wiley & Sons
Page : 642 pages
File Size : 48,8 Mb
Release : 2009-10-13
Category : Technology & Engineering
ISBN : 9780470455258
This invaluable resource tells the complete story of failure mechanisms—from basic concepts to the tools necessary to conduct reliability tests and analyze the results. Both a text and a reference work for this important area of semiconductor technology, it assumes no reliability education or experience. It also offers the first reference book with all relevant physics, equations, and step-by-step procedures for CMOS technology reliability in one place. Practical appendices provide basic experimental procedures that include experiment design, performing stressing in the laboratory, data analysis, reliability projections, and interpreting projections.
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 54,6 Mb
Release : 2014-10-12
Category : Electronic
ISBN : 1479972754
The IIRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems
Author : Joseph B. Bernstein,Alain Bensoussan,Emmanuel Bender
Publisher : John Wiley & Sons
Page : 404 pages
File Size : 41,6 Mb
Release : 2024-02-13
Category : Technology & Engineering
ISBN : 9781394210954
RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.